ASU and Deca Technologies Chosen to Lead $100 Million SHIELD USA Initiative to Enhance U.S. Semiconductor Packaging Capabilities

The National Institute of Standards and Technology is awarding $100 million to Arizona State University and Deca Technologies for the SHIELD USA initiative, which aims to drive innovation in the microchip packaging ecosystem, expand domestic capacity for advanced packaging, and strengthen U.S. leadership in microelectronics for national security. This is the first program under the CHIPS National Advanced Packaging Manufacturing Program, focusing on organic materials and substrates. ASU President Michael Crow emphasized the importance of semiconductor independence and competition with China in unlocking future innovation. The SHIELD USA team, led by ASU and Deca Technologies, will develop molded core substrates to enable high-performance computing for artificial intelligence, wireless communication, and power electronics. The initiative aims to accelerate R&D, strengthen domestic supply chains, expand workforce capacity, and support U.S. leadership in semiconductor packaging to reestablish a domestic supply chain. By partnering with leading industry players, the initiative will enable the reshoring of packaging and secure the long-term viability of the U.S. semiconductor supply chain. The program also includes education and training efforts to support a sustainable domestic pipeline of packaging substrates and materials research. Key semiconductor companies and manufacturers are participating in the initiative to design, simulate, and test the technology, with the support of U.S. Secretary of Commerce Gina Raimondo.

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